
3 Day Open Conference
Modeling and analysis support effective electro-mechanical systems integration
Tuesday 18th November 2008
10.30 - 11.00
Auditorium 2
Designing distributed systems now also requires a distributed set of tasks, with many disciplines and suppliers involved in the process, which brings new challenges to address, especially in communication and integration. The system integration phase is a frequent bottleneck. Bringing subsystems and components together into a single system can be a risky, trouble prone, and unpredictable process. Unanticipated problems found at this point in the program can require redesign of subsystems and components or even refinement of the systems requirements, usually resulting in long delays. Challenges include the combinations of electronics and control in the electro-mechanical interface, and interaction of mechanics, electronics and software. Designing a system in a modelled form and analyzing its characteristics in extreme operating conditions can help reveal problems early enough in the design flow to avoid expensive rework and major production delays.
About the Speaker(s):

Mr Rick Pier
Marketing Manager
Mentor Graphics
Rick Pier has been with Mentor Graphics since 1995. Most recently he has been managing teams developing solutions for vehicle networking, design and verification. Previously he managed engineering groups developing board level signal integrity, timing analysis and EMI analysis applications. He has also been a technical marketing engineer, a high-speed applications engineer and a simulation consultant in Mentor Consulting.
Before joining Mentor Graphics, Rick was a staff engineer at Siemens Medical Systems-Ultrasound Group, a hardware design engineer at Boeing High Technology Center, and a systems engineer at Singer - Link Flight Simulation Division,
Rick holds a graduate degree in technical management from the University of Wisconsin- Madison, a master’s degree in electrical engineering from the University of Washington and a bachelor’s degree in electrical engineering from Marquette University.
Rick is an IEEE Senior Member.